OpenAI 大话互联网 2023-07-06 11:01:16 Frontier AI regulation: Managing emerging risks to public safety Read paperAbstractAdvanced AI models hold the promise of tremendous benefits for humanity, but socie... 评论 分享 微信扫一扫：分享 微信点“扫一扫” 点右上“...”，便可分享本文
Meta nightclub 2023-06-20 12:04:00 Omni3D: A Large Benchmark and Model for 3D Object Detection in the Wild AbstractRecognizing scenes and objects in 3D from a single image is a longstanding goal of computer ... 评论 分享 微信扫一扫：分享 微信点“扫一扫” 点右上“...”，便可分享本文
Meta 大话互联网 2023-06-18 10:23:36 Galactic: Scaling End-to-End Reinforcement Learning for Rearrangement at 100k Steps-Per-Second AbstractWe present Galactic, a large-scale simulation and reinforcement-learning (RL) framework for ... 评论 分享 微信扫一扫：分享 微信点“扫一扫” 点右上“...”，便可分享本文
OpenAI 大话互联网 2023-05-31 12:24:37 Improving mathematical reasoning with process supervision Read paperDownload dataset... 评论 分享 微信扫一扫：分享 微信点“扫一扫” 点右上“...”，便可分享本文
IBM 科技百花 2023-05-30 15:30:55 Volume-controllable Solder Bumping Technology to Package Substrate Using Injection Molded Solder for Fine-pitch Flip Chip AbstractIt is challenging to successfully bond large Si chips onto a package substrate with fine-pit... 评论 分享 微信扫一扫：分享 微信点“扫一扫” 点右上“...”，便可分享本文
IBM 大话互联网 2023-05-30 14:40:05 A Scalable Heterogeneous AiP Module for a 256-Element 5G Phased Array AbstractThis paper presents design and integration considerations of a scalable 24 -- 30 GHz 256-ele... 评论 分享 微信扫一扫：分享 微信点“扫一扫” 点右上“...”，便可分享本文
IBM nightclub 2023-05-30 12:02:04 Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications Abstract3-D stacking of chiplets in Heterogeneous Integration (HI) packages with interconnects to su... 评论 分享 微信扫一扫：分享 微信点“扫一扫” 点右上“...”，便可分享本文
IBM 科技百花 2023-05-30 11:35:43 Modeling of the Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages AbstractThe impact of thermal compression bonding (TCB) process parameters on interconnect quality a... 评论 分享 微信扫一扫：分享 微信点“扫一扫” 点右上“...”，便可分享本文
IBM 大话互联网 2023-05-30 10:01:30 Signal and Power Integrity Design and Analysis for Bunch-of-Wires (BoW) Interface for Chiplet Integration on Advanced Packaging AbstractThis work advances the current understanding and performance assessment of chiplet interface... 评论 分享 微信扫一扫：分享 微信点“扫一扫” 点右上“...”，便可分享本文
IBM 科技百花 2023-05-30 08:59:38 Electrical Characterization and Modeling of 2-µm and 1.5-µm Line-and-Space High-Density Signal Wiring in Organic Interposer AbstractAs the demand for small form-factor and more capable electronic devices continues to grow, t... 评论 分享 微信扫一扫：分享 微信点“扫一扫” 点右上“...”，便可分享本文
DeepMind 大话互联网 2023-05-29 09:10:46 Search-Improved Game-Theoretic Multiagent Reinforcement Learning in General and Negotiation Games DownloadAbstractMultiagent reinforcement learning (MARL) has benefited significantly from population... 评论 分享 微信扫一扫：分享 微信点“扫一扫” 点右上“...”，便可分享本文
OpenAI nightclub 2023-05-09 11:31:37 Language models can explain neurons in language models Read paperView neuro... 评论 分享 微信扫一扫：分享 微信点“扫一扫” 点右上“...”，便可分享本文
